LPKF MicroLine 740C

back to overview

November 2004
 

New laser system for cutting circuits

Garbsen, November 2004 - LPKF Laser & Electronics AG presents the new LPKF MicroLine 740C laser system, the perfect tool for high-speed contour cutting of rigid and flexible PCBs. High throughput performance is ensured by its new CO2 laser.

With its extra-large working area, boards up to 31“ x 28“ can be precisely machined without any residue.

Other applications for the MicroLine 740C are opening thin glass fiber materials, cutting organic materials and structuring layers and cavities. Even densely-populated circuit boards can be easily machined.

Using sophisticated optical fiducial recognition, the system equalizes stretch/shrink deformation caused by the board manufacturing process. This provides much higher board profile accuracy when compared to mechanical cutting.

back to overview