LPKF MicroCut

back to overview

November 2004
 

A new generation of StencilLasers – the LPKF MicroCut

Garbsen, November 2004 –  The LPKF MicroCut can cut any shape at speeds up to 50,000 apertures per hour. With this capability, the MicroCut delivers double the cutting speed of current state-of-the-art stencil cutting lasers.

A specially-developed system greatly reduces mechanical movement by moving the laser beam more dynamically and precisely than current x/y tables.

With its focus diameter of 20 µm, it can cut sharp contours with a radius down to 10µm. The roundness accuracy for even the smallest circles is 96%.

The system also incorporates new cutting technology that avoids burrs at the cutting edges, so no post-treatment is necessary.

LPKF’s exclusive PulseShape technology eliminates heat effects, even while machining high-density or thin stencils. As a result, no external coolant is required.

back to overview