Hanover Fair/Interkama 2004

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April 2004
 

Easy through-plating of prototype PCBs

Hannover, April 2004 - Electroforming can be used for the direct throughplating of PCBs in development labs. LPKF Laser & Electronics AG now presents at Interkama 2004 the new MiniContac S through-plating machine specifically designed for this purpose. This table-top device metallises PCB vias with a minimum diameter of 0.4 mm using the blackhole method.

MiniContac S complements the LPKF Laser & Electronics AG products for in-house prototype PCB production with an alternative which is just as reliable and even cheaper than the LPKF MiniContac III. With options such as reverse pulse plating, and a 1:10 aspect ratio, the LPKF MiniContac III is still the ultimate choice for laboratory through-plating. Both systems can process double-sided and multi-layer PCBs in 9 x 12 inch format. They perfectly match the LPKF ProtoMat C series circuit board plotters and the LPKF ProtoLaser structuring laser. MiniContac S can also be integrated within all existing PCB sample production lines.

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