LPKF Applications Center Shenzhen

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March 2004
 

LPKF Applications Center for PCB reworking to open in Shenzhen, PR China in May, 2004

The center will provide PCB manufacturing assistance to China and Southeast Asia

CPCA Shanghai, March, 2004 – LPKF Laser & Electronics AG, Garbsen, announces the founding of an applications center for PCB reworking in Shenzhen, PR China.

Opening in May, 2004, the new Applications Center will assist PCB manufacturers in China and Southeast Asia in the integration of laser technology within their PCB production processes.

The range of services includes the cutting and structuring of circuit carriers, laser drilling of microvias, and other micro-scale laser machining. The development of client-specific processes for laser machining is also planned.

The Applications Center is equipped with LPKF UV laser cutting and drilling machines, systems for mechanical and chemical processing of circuit boards, and relevant measuring and analytical equipment.

With its new Applications Center in Shenzhen, LPKF Laser & Electronics AG complements its existing office in Tianjin. Shenzhen is an important center for the electronics industry, and particularly for PCB production.

The use of UV lasers in PCB production enables ultra-fine structures to be generated at precisely the right position without the use of other tools or films. UV lasers can open up solder resist coatings and covering films, and create openings and cavities. Laser cutting enables extremely fine circuit carriers to be precisely cut out of flexible material – the components remain undamaged because no mechanical force is used.

The laser equipment built by LPKF Laser & Electronics AG also enables medium-sized enterprises and institutes to enter the HDI field. HDI PCBs have particularly fine structures and microvias between each conducting layer.

PCBs of this kind can be used in areas such as portable electronic devices, and they open up a growing market for Chinese producers.

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