ScanCheck MicroView

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November 2003

24,000 dpi stencil inspection

Garbsen, November 2003 - LPKF Laser & Electronics AG introduces the ScanCheck MicroView – a fast, high resolution inspection system for wafer stencils with 24,000 dpi resolution.

Stencils used for solder paste printing directly on wafers often use hundreds of thousands of apertures sometimes smaller than 2 mil (50 µm) in diameter. This represents a major challenge for stencil inspection systems. LPKF’s MicroView system has to overcome this limitation and delivers 100% quality control within a reasonable timeframe. The system verifies all apertures on the stencil for presence, positioning, geometric accuracy and possible clogging of the holes. It also identifies pinholes and faulty pad connections.

A line camera with an optical resolution of 5000 dots per inch and the software interpolation with up to 24,000 dpi deliver a scan image that is compared against the original CAD data.

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