LPKF introduces the MicroLine Cut 350

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November 2003

A multifunctional UV laser system for cutting, drilling and structuring

Garbsen, November, 2003 – LPKF Laser and Electronics AG introduces the MicroLine Cut 350, a compact, low-cost laser system that joins LPKF’s MicroLine Drill product family. This versatile laser system offers a large range of functions and is suitable for cutting flexible and rigid PCBs, structuring ultra-fine tracks on copper and resist, and creating openings in solder resist and cover foils, as well as drilling and cutting ceramics, plastics, and green tapes.

Using die-cutting or mechanical milling can be challenging with high-density flex circuits. The UV laser of the MicroLine Cut 350 provides an alternative with its high beam quality and minimum focal point diameter of 20 µm. It effectively avoids thermal damage to adhesive layers during cutting of individual layers in the production of flex and rigid circuit boards, and it eliminates delamination problems in the final cut of flex-circuits. Even highly complex PCB shapes can be reliably produced.

The MicroLine Cut 350 cuts individual assembled PCBs from a panel without creating mechanical stresses. Any vapors that are produced are completely extracted. The laser system has a machining range of 400 x 310 x 50 mm, and it is also available with a vacuum table.

The MicroLine Cut 350 laser system provides PCB manufacturers, institutes, and corporate R&D departments with an extremely versatile laser system.

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