LPKF introduces the MicroLine 3D IR Industrial laser

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November 2003

A high-quality system for the mass production of three-dimensional injection-molded interconnect devices (MIDs)

Garbsen, November 2003 – LPKF Laser & Electronics has developed the MicroLine 3D IR Industrial laser system for the production of three-dimensional injection-molded interconnect devices (3D-MIDs).

With a modular machining area that is adjustable from 60 x 60 x 12 mm to 200 x 200 x 100 mm, LPKF's Laser Direct Structuring (LDS) process produces 3D MIDs made of modified plastics. The laser transfers the circuit pattern to the circuit carrier, activating those sections which are electroless plated in a process without an external power feed. MIDs made of laser-structured plastic combining mechanical and electrical functions can be structured and activated in large numbers on the MicroLine 3D IR Industrial. Applications include mobile phone cases, sensor carriers, and other three-dimensional components.

Synchronous control of three optical axes (x, y, z) enables continuous guidance of the IR laser beam over the three-dimensional surface, ensuring the transfer of the circuit pattern onto the plastic. The system features high beam quality for precision focusing with a very small focal point diameter. Combining this with a high pulse repetition rate, the system produces reliable high-speed processing while generating sharp contours with minimal surface irregularities.



The MicroLine 3D IR Industrial laser has a fully automated circular indexing table, so a ready structured interconnect device can be removed and another inserted ready for structuring while laser processing is underway. This capability makes the MicroLine 3D IR Industrial suitable for production line applications. A camera system ensures precision placement by identifying the position of the device via register marks and then employing online data correction to position, rotate, or scale the circuit diagram.

The MicroLine 3D IR Industrial laser system is also suitable for structuring metal coatings, cutting flexible and rigid PCBs, structuring ultra-fine tracks on copper and resists, making non-abrading marks, and engraving.

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