LPKF MicroLine 3D IR 160

back to overview

April 2003

LPKF MicroLine 3D IR 160 Prototype production of 3-dimensional injection-moulded circuits carriers (3D MID)


Hanover, April 2003. Technical innovations drive industry forward − now and in future. This fact was recently highlighted at the CEBIT 2003 Exhibition, where new electronic devices on show like mobile phones, headsets and PDAs were both smaller and had more functions than ever before.  This miniaturisation and increase in circuit functions can be further enhanced by the use of 3D-MID technology.

LPKF has further extended its MicroLine product family with the economical LPKF MicroLine 3D IR 160 Laser System. This high-tech laser system structures and activates specially modified plastics using the LPKF-LDS technology (laser direct structuring). With a machining range of 160 x 160 x 25mm, the laser directly structures high-density circuit patterns onto three dimensional circuit carriers.  The activated areas are subsequently chemically plated.  This selective plating method considerably shortens the otherwise lengthy manufacture of injection-moulded circuit carriers (MIDS).

The LPKF MicroLine 3D IR 160 is the first system of its kind to enable the simple structuring of three dimensional MIDs. The height adjustable Z-axis allows easy positioning of different sized circuit carriers.

This new system uses an IR laser, but a UV laser can also be fitted for machining hard materials like ceramics and LTCC. The precise and highly dynamic deflector guarantees that structuring of the circuit takes only seconds even with larger areas such as mobile phone antennae or contact elements.

In addition to the LDS method the system can also structure 21/2 D metal layers, cut flexible and rigid PCBs, structure ultra fine tracks on copper or resists as well as marking and milling. The laser system has been initially designed as a manual workplace but a conveyor or dial feed option can be fitted for higher volume production.

The manufacturing sequence for the production of 3D-MIDs will be demonstrated by LPKF Laser & Electronics AG for the first time at Hanover Fair 2003 on the VDMA stand with Klocke Nanotechnik and other micro production partners.  A 12 x 12 mm HF circuit carrier will be structured three dimensionally and then fitted with a nano-positioner.

back to overview