Milestone for the MID-Technology

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July 2003
 

LPKF Laser & Electronics AG and Bayer Polymers to co-operate in the field of laser-compatible polymers

Bayer Polymers has signed a know-how and license agreement with LPKF Laser & Electronics AG about the laser compatible modification of polymers.

This kind of plastics is especially suitable for the production of three dimensional interconnect devices according to LPKF’s LDS process. With the LDS process conductive tracks on a molded interconnect device (MID) are structured and activated for chemical metallizing by means of a laser. LDS is a very cost-effective way e.g. to integrate antenna structures into the frame of hand held electronic devices. In addition MID parts for medical instruments and automotive applications can combine mechanical and electrical functions.

Already in April 2003 Degussa AG had signed a similar know-how and license agreement with LPKF Laser & Electronics AG regarding cross- linkable polymers for LDS. With Bayer Polymers entering the market of MIDs a whole variety of important PBT and PET materials will become available for industrial use of LDS in the future.

For the MID manufacturer, who will introduce the LDS process to serial production, the choice of the right polymer according to the corresponding requirements and a reliable industrial polymer supplier are essential conditions.

LPKF Laser & Electronics AG delivers special laser systems for structuring of three dimensional interconnect devices.

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