High-Speed Laser Cutting of Wafer Stencils

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November 2003

50,000 cutouts per hour, and in any shape

Garbsen, November 2003 – LPKF Laser & Electronics AG demonstrated at Productronica 2003 their wafer stencil cutting speed of up to 50,000 cutouts per hour. The very small cutouts can be made in any shape, and with a minimum radius of only 10 micrometers.

"This has created a breakthrough for the general use of laser technology in cutting wafer stencils. The key lies in the combination of a special laser source with the 4th generation TurboCut – an optical system that cuts small apertures extremely fast and in any shape without moving the X/Y table"," emphasizes Stephan Wenke, LPKF Laser Systems Manager.

Economical use of laser technology was previously hindered by throughput when cutting non-round shapes. Wafer stencils often have several tens of thousands of cutouts in an extremely fine pitch, and these geometries are very demanding on the precision and throughput of the production process. LPKF’s 4th generation TurboCut technology overcomes these challenges and allows wafer stencil cutting with superior overall quality and uniform material thickness.

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