LPKF Laser Center

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April 2003

Laser micro material processing as a job shop service

New LPKF Laser Center provides customers with a wide range of applications


Munich, June 2003 - LPKF continued to increase its position as a service partner for laser micro material processing. The establishment of a Laser Center at LPKF`s Garbsen headquarter will provide customers involved in microelectronics, micro-systems technology, medical technology, telecommunication etc. with the possibility to access one of the most advanced technologies in the field of laser micro material processing.

In today’s continuing overall weakness in the global economy, many users in the electronics market are hesitant to invest large sums in the procurement of new technologies. However, at the same time there is an urgent need to produce finer structures and conductor lines due to the fast innovation pace and continuing miniaturization − structures which can often be realized by laser processing.

At the Laser Center, users whose investment budget does not stretch to the procurement of this sophisticated equipment, now have access to e. g. superior laser drilling or ultra-fine structuring. At this time the service
will be used by many renowned companies.

Because the development and production sites are that close, LPKF does not only provide customers with the necessary technical equipment, but also gives them access to its process expertise.


The laser sources at the Laser Center are available in various system configurations and consist of excimer laser systems with the wavelengths 248 and 308 nm as well as solid-state lasers of wavelengths 355, 532 and 1064 nm in the performance categories relevant for micro material processing.  A novelty is the Q-switched CO2 Laser that combines the advantages of high pulse peak power, short pulses and high pulse repetition rates. For applications, this laser is especially advantageous due to the minimum of thermal influence.

The Laser Center thus provides its clients with an extraordinarily broad spectrum of applications ranging from micro drilling and structuring via scribing, cutting, engraving, marking and ceramic processing up to ablation of thin metallic or organic resists for producing of sensory components. The Laser Center offers a variety of special services, consulting in application, support in product design, feasibility studies und application oriented research and development.


Service offered by LPKF’s Laser Center has already been frequently used by customers, and to LPKF Laser & Electronics AG it paves the way to valuable solutions and the selection of new technologies and markets.

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