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Press releases 2003
| 11/2003 | » | LPKF and the Harting Technology Group have signed a cooperation agreement. |  CooperationHarting (14 KB) |
| 11/2003 | » | LPKF introduces new series of Pick & Place machines. LPKF ProtoPlace - A semi-automatic placing system for professional SMD assembly of prototype PCBs and small production batches. |
ProtoPlace (142 KB) |
| 11/2003 | » | LPKF sets new standards for automated PCB prototype production. The ProtoMat H100 PCB plotter achieves the highest precision at twice the operating speed. |
ProtoMat H100 (137 KB) |
| 11/2003 | » | LPKF introduces the MicroLine Cut 350. A multifunctional UV laser system for cutting, drilling and structuring. |
MicroLine Cut 350 (139 KB) |
| 11/2003 | » | LPKF introduces the MicroLine 3D IR Industrial laser. A high-quality system for the mass production of three-dimensional injection-molded interconnect devices (MIDs). |
MicroLine3D IR Industrial (217 KB) |
| 11/2003 | » | LPKF Demonstrates High-Speed Laser Cutting of Wafer Stencils: 50,000 cutouts per hour, and in any shape |
High-Speed Laser Cutting of Wafer Stencils (144 KB) |
| 11/2003 | » | LPKF establishes LaserMicronics GmbH for high-quality laser micro-processing services. |
Lasermicronics (138 KB) |
| 11/2003 | » | LPKF and Ticona sign license agreement for Laser Direct Structuring (LDS) with Vectra LCP | TiconaLicenseAgreement (146 KB) |
| 11/2003 | » | LPKF introduces the ScanCheckMicroView - a fast, high resolution inspection system for wafer stencils with 24,000 dpi resolution. | ScanCheck MicroView (138 KB) |
| 11/2003 | » | LPKF with clear profit. | Q3-2003 (48 KB) |
| 10/2003 | » | Ticona GmbH and LPKF AG sign know-how and licence agreement. Another new material for the 3D-MID process. |
07.10.2003 / LPKF: Profit in second quarter leads to almost balanced first half results (64 KB) |
| 08/2003 | » | LPKF: Profit in second quarter – almost balanced first half results. | Q2-2003 (48 KB) |
| 07/2003 | » | LPKF and Bayer Polymers to co-operate in the field of laser-compatible polymers. | 21.07.2003 / Know-how and licence agreement with Bayer AG in the field of 3D-MID circuits (57 KB) |
| 06/2003 | » | ELASER has tranferred the manufacturing of stencils to Sparks Laser Services GmBH . | |
| 05/2003 | » | LPKF and Degussa sign licence agreement to promote 3D-MID technology. |
17.04.2003 / LPKF expects market to remain difficult in 2003 successfully to push 3D-MID (56 KB) |
| 05/2003 | » | LPKF expects turnover in 2003 like the previous year. | LPKF expects turnover (60 KB) |
| 04/2003 | » | The new LPKF Laser Center has been established for offering laser material processing services. | |
| 04/2003 | » | Three-dimensional circuit carrier ready for industrial application. New 3D-MID application center demonstrates complete process. | |
| 04/2003 | » | LPKF MicroLine 3D IR 160:Prototypes Production of 3-dimensional injection-moulded circuits carriers (3D MID). |
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| 04/2003 | » | Highest precision at twice the operating speed LPKF ProtoMat H100 sets new standards for automated prototype production. |
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| 03/2003 | » | LPKF strengthens its range of services. | Result2002 (186 KB) |
| 01/2003 | » | LPKF receives admission to Prime Standard. | PrimeStandard (47 KB) |
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