3D-MID application center

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April 2003
 

Three-dimensional circuit carrier ready for industrial application

New 3D-MID application center demonstrates complete process

LPKF Laser & Electronics AG recently established a laser application service center for Laser Direct Structuring (LDS) of three dimensional moulded interconnect devices (3D-MID’s). This center allows customers to utilize this technology for both prototypes and production.

Injection-moulded circuit carriers (MIDs) make it possible to combine the electronics and mechanics of the electronic devices without the complications of multiple moulds and multiple injections. With the Laser Direct Structuring method developed by LPKF, it’s possible to produce high-resolution circuits on complex three-dimensional carriers that functionally integrate the previous separate housing and circuit board elements. The method uses on doped thermoplastics on which the conductors to build up can be precisely activated by a laser beam and subsequently metalization in an additive process.

To make the method suitable for industrial applications, it was first necessary to modify the basic materials used in the electronics industry to make it possible to steer laser-induced selective metalization. By modifying extra heat-resistant thermoplastics, among other materials, LPKF succeeded in producing 3D-MIDs using the LDS method, which are also suitable for reflow-soldering as well as the classic industrial serial production of electronic components.

LPKF’s service and application center demonstrates the complete process chain including injection moulding, laser direct structuring and metalization. It will also show the enormous design flexibility and effectiveness by reducing the number of components. 3D circuits also allow greater miniaturisation of electronics assemblies.

To close the gap between product development and serial production LPKF recently qualified the LPKF-LDS-Technology for standard prototyping like SLS (selective laser sintering) and PUR resins for vacuum moulding. Now MID prototypes can be processed without even an injection moulding tool - the 3D-CAD design data is sufficient. In practice within two weeks a electric functional prototype of an MID can be produced.

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