StencilLaser SL 600 MicroCut

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November 2002

High precision for small structures

The LPKF StencilLaser SL 600 MicroCut − the perfect tool for high-end applications

Boasting technical features that raise stencil technology to a new dimension in ultrafine applications, the SL 600 MicroCut, complements LPKF's StencilLaser product line with a new system specially designed to fulfil the production specifications for miniaturised semiconductor component stencils . With its extreme positioning precision, fast operating speed (even for minimum structural dimensions) and the superb quality of the cut edges, the SL 600 MicroCut is the ideal tool for the production of chip scale packages (CSP), flip chips and OLE displays.

The SL 600 MicroCut is based on the proven SL 600 HS but has a specially developed laser source for extremely fine focussing. This enables it to cut openings down to 30 µm. Additional flexibility is made possible by varying the laser pulse length using the LPKF PulseShape method.

A direct comparison with additively produced stencil structures reveals the clear superiority of the stencils made with the
SL 600 MicroCut. This is due thanks

• to the greater regularity of stencil thickness
• the higher dimensional stability of the stencils in operational use
• the far lower reject rate.

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