PAMID Granulate Material

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April 2003
Laser direct structured MIDs now fully reflow-capable

PA6/6TMID, a new high temperature plastic from LPKF, enables the processing of laser direct structured injection moulded circuit carriers in a reflow soldering process for the first time.

A new technology captures a new market segment: the introduction of the new special plastic PA6/6TMID into the market for the production of three-dimensional injection moulded circuit carriers means it is possible for the first time to produce reflow-capable MIDs (Moulded Interconnect Devices) using Laser Direct Structuring - the LPKF LDS process. This means that MID technology can now be integrated into standard SMD processes, effectively knocking down the barrier for the processing of SMD-equipped MID modules. This market entry by LPKF therefore opens the road for a broader application of 3D-MID technology in the electronic industry. The extraordinarily high temperature resistance (melting point 295 °C), together with the straightforward processing (due to the well-known properties of the partially-aromatic polyamide base polymer PA6/6T), in conjunction with the high mechanical strength and rigidity, all combine to create the excellent suitability of this new thermo-plastic for electronic modules.


PA6/6TMID is a plastic which can be activated by laser to apply the LDS process developed by LPKF. A laser beam tuned to the material is guided by the LPKF 3D laser over the surface areas of the injection moulded part which requires metallisation. Together with a downstream wet-chemical metallisation process, this technique allows the generation of high-adhesion conductor tracks on injection moulded circuit carriers.

The laser beam provides for synchronised triggering of two physico-chemical processes. Metal nuclei are split from special non-conducting activating substances, to allow downstream metallisation in copper immersion baths without external power feed. At the same time, a defined roughness is generated on the irradiated surface using additives to create the adhesion surface for the metal coating layer in the immersion bath.

Compared with other MID production processes, for example 2-component injection moulding, this new process offers a number of persuasive advantages.

-Straightforward, rapid processing with few steps, i. e. injection moulding, laser structuring, metallisation − offering ecological advantages: no solvents, no caustic or etching processes.
-Creation of circuit layout using laser control (software) as opposed to tool geometry (hardware), and the added benefit of having a simple 1-component injection moulding tool and hence reduced tool costs. This combines with reduced lead times, higher levels of flexibility and enhanced profitability even for small batch sizes.
-High structural resolution typical for laser applications. The benefits are found directly in the high miniaturisation potential offered by this new technology: the LDS process allows straightforward production of conductor track widths and separations of around 100 µm.

LPKF offers two more LDS plastics in addition to PA6/6T MID: LPKF-PBTMID, on a polybutylene reptholate base, is suitable for broad industrial applications with medium  temperature resistance requirements, as well as PPMID, on a polypropylene base, for "low temperature" applications, in which electrical signal transmission is combined with mechanical functionality.

The LPKF booths at this year's Hannover Messe 2002 (booths D14 and B40 in hall 6) are the right places for interested parties from all sectors of the electronics industry and other application sectors in which mechatronics (i. e. the combination of electrical and mechanical functions) is in demand: the site provides information for professionals to build get an idea of this future-oriented technology, and also offers in-depth expert advice and consultation.

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