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LPKF MicroLine Drill

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June 2002

Microvia drilling and structuring with a single tool
Entry into HDI technology for small and medium-sized enterprises


Hanover, April 2002 − The MicroLine Drill 600 by LPKF is a tool which allows small and medium-sized PCB manufacturers to meet the growing demand for high density interconnect (HDI) PCBs with microvias and ultra-fine printed conductors.

A special feature of this completely innovative combination of two previously distinct technical options: users now have the ability to use one and the same machine to implement a broad spectrum of applications in connection with HDI PCBs. In addition to the laser drilling of microvias, this tool provides for structuring of ultra-fine conductors directly into copper or resist, and therefore the capability to produce for example ultra-fine solder-stop masks. In addition, the MicroLine Drill 600 offers another application which is enjoying a considerable upswing of interest: the cutting of flexible and rigid assembled PCBs.

These features and capabilities mean that companies previously unable to operate a pure laser drilling machine economically can now adopt multiple applications to achieve capacity working, and quickly enter the profitability zone.

The tool can process a wide range of standard PCB materials as well as special structures on PCBs made of ceramics, with metal cores or thick copper coatings.

During the development of this machine, special attention was directed at optimising bore quality with regard to geometry and cleanness. This effectively waives the need for additional cleaning steps prior to galvanic through-plating.

As may be expected for a tool capable of producing extremely small microvias of up to 50 µm diameter and conductors of up to 25 µm width, the MicroLine Drill 600 is an extremely high precision unit. The highly developed sensor system allows a positioning accuracy of up to 10 µm.

This unit's portfolio is complemented by an automatic handling system which allows users to process up to 25 PCBs sequentially. The filling of the magazine as well as the precise positioning via LPKF-developed Vision Software now enables PCB manufacturers to implement a fully automated production of small to medium sized batches and series of HDI boards.

Another very important advantage: the simple design and the use of only a single laser source keeps investment levels down and in particular the operating costs of the MicroLine Drill 600 under tight control.

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For further information, press leaflets or brochures please contact us at:

LPKF Laser & Electronics AG
Marketing/Press
Osteriede 7
30827 Garbsen

Tel.:  +49-(0)5131-7095-0
Fax:  +49-(0)5131-7095-90

Email: marketing@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90