| 12/2002 | » | |
| 11/2002 | » | |
| 11/2002 | » | High precision for small structures: The LPKF StencilLaser SL 600 MicroCut − the perfect tool for high-end applications. |
| 11/2002 | » | Economical entry model with proven process reliability. LPKF StencilLaser SL 740 − the perfect tool for entering stencil production with Laser |
| 10/2002 | » | LPKF expands strategic orientation in the laser plastic welding segment. |
| 06/2002 | » | Microvia drilling and structuring with a single tool. Entry into HDI-technology for small and medium-sized enterprises. |
| 06/2002 | » | New LPKF ProtoMat X60 for processing assembled and non-assembled PCB panels. Far-reaching enhancements for PCB manufacturers and assembly contractors. |
| 05/2002 | » | Laser direct structured MIDs now fully reflow-capable. PA6/6TMID, a new high temperature plastic from LPKF, enables the processing of laser direct structured injection moulded circuit carriers in a reflow soldering process for the first time. |
| 05/2002 | » | More production reliability in the laboratory LPKF Contac III and MiniContac III through-plating systems with reverse pulse plating for the first time. |
| 05/2002 | » | LPKF ProtoMat C40 - The reliable system for circuit board prototype production. |
| 04/2002 | » | Assembly for the Highly Integrated Circuit Board LPKF ZelPlace BGA − perfect handling for the new component generation. |
| 04/2002 | » | Innovative UV laser system for micro-processing MF 100 UV uses short wavelengths to generate ultra-fine structures. |
| 03/2002 | » | |
| 08/2002 | » |
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