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Press releases 2002

12/2002 » LPKF applies for admission to Prime Standard.
11/2002 » LPKF with high level of orders in hand.
11/2002 » High precision for small structures:
The LPKF StencilLaser SL 600 MicroCut − the perfect tool for high-end applications.
11/2002 » Economical entry model with proven process reliability. LPKF StencilLaser SL 740 − the perfect tool for entering stencil production with Laser
10/2002 » LPKF expands strategic orientation in the laser plastic welding segment.
06/2002 » Microvia drilling and structuring with a single tool. Entry into HDI-technology for small and medium-sized enterprises.
06/2002 » New LPKF ProtoMat X60 for processing assembled and non-assembled PCB panels.
Far-reaching enhancements for PCB manufacturers and assembly contractors.
05/2002 » Laser direct structured MIDs now fully reflow-capable. PA6/6TMID, a new high temperature plastic from LPKF, enables the processing of laser direct structured injection moulded circuit carriers in a reflow soldering process for the first time.
05/2002 » More production reliability in the laboratory
LPKF Contac III and MiniContac III through-plating systems with reverse pulse plating for the first time.
05/2002 » LPKF ProtoMat C40 - The reliable system for circuit board prototype production.
04/2002 » Assembly for the Highly Integrated Circuit Board
LPKF ZelPlace BGA − perfect handling for the new component generation.
04/2002 » Innovative UV laser system for micro-processing
MF 100 UV uses short wavelengths to generate ultra-fine structures.
03/2002 » LPKF gears itself up for the future.
08/2002 » LPKF well in the black.
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LPKF Laser & Electronics AG
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Osteriede 7
D-30827 Garbsen
Germany

Tel.:  +49-(0)5131-7095-0
Fax:  +49-(0)5131-7095-90

Email: marketing@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90