Good news for the LDS technology: the engineers and technicians have further optimized the top model for laser direct structuring, the LPKF Fusion3D. With a few targeted steps the LPKF was able to again noticeably reduce structuring times for three-dimensional circuit boards: head of the business division, Nils Heininger, alludes to a performance increase of 10 to 20 percent depending on the component layout.
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