2010

Good news for the LDS technology: the engineers and technicians have further optimized the top model for laser direct structuring, the LPKF Fu-sion3D. With a few targeted steps the LPKF was able to again noticeably reduce structuring times for three-dimensional circuit boards: head of the business division, Nils Heininger, alludes to a performance increase of 10 to 20 percent depending on the component layout.read more...

Garbsen, 21 June 2010 - Another laser system by LPKF is taking the stage. With the MicroLine 1000 S LPKF presents a very compact and cost-effective system for UV-laser cutting of assembled PCBs. According to Dr. Ingo Bretthauer, Chairman of the LPKF Board of Directors, this system reflects the spirit of the time: “The MicroLine 1000 S combines a low entry level price with the highest cutting quality and superior process capabilities. At the same time it is especially flexible and therefore suited for high manufacturing variance. We are using a laser source which was optimized just for this application”.read more...

Two trade shows at once – each showing a new systems. This always makes a visit to the LPKF booth worth while, whether it’s at the Lasys or the SMT.read more...

Erlangen (Germany) May, 6 2010 – At this year’s LASYS, the trade fair for system solutions for laser material processing, LPKF will be showcasing the new LQ-Vario RT, a flexible and compact laser welding system specially designed for the economical processing of small and medium-sized batches. A rotary table speeds up mechanical loading and makes the machine much more productive.read more...

Hannover, 21 April 2010: “The prize money of Euro 100,000 is naturally of great value, but the response to the Hermes Award in terms of visitor numbers and media interest is almost priceless.” LPKF CEO Ingo Bretthauer is extremely satisfied with the first days at the show after receiving what must be one of the top innovation prizes from the hands of the German Minister for Education and Research, Anette Schavan. read more...