Good news for the LDS technology: the engineers and technicians have further optimized the top model for laser direct structuring, the LPKF Fu-sion3D. With a few targeted steps the LPKF was able to again noticeably reduce structuring times for three-dimensional circuit boards: head of the business division, Nils Heininger, alludes to a performance increase of 10 to 20 percent depending on the component layout.
 
The increased speed is the result of dramatically revised optics and laser control.  “Highly dynamic components and optimized algorithms are resulting in shortened processing times and reduced unit costs”, Heininger comments. He emphasizes the aptness for a high level of product variability. In april this laser system gained the prestigiuos Hermes Award 2010.

Since last year LPKF is excited about an increased demand even from smaller producers. Making it therefore all the more welcome that the laser head costs could be reduced: higher performance for less money.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.

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