The Third Dimension: Structuring of electronic circuits on plastic parts
04/Mar/2008
Garbsen, March 2008 – The LPKF-LDS Method produces electronic circuits directly on three-dimensional injection-moulded plastic parts. The laser process allows fast and flexible design changes, and can produce more precise structures than conventional MID techniques.
Ready to use with integrated guaranteed future: Laser plastics welding with new LQ-Axis series
04/Mar/2008
Erlangen, 26 February 2008 – The new turnkey system LQ-Axis extends LPKF’s existing spectrum of standard laser plastic welding systems. The laser welding system is designed to specifically meet the requirements of contour welding of 2D micro and macro-modules. Moreover, it can be well used for the patented hybrid welding technology.
LPKF starts new sales office in Detroit, Michigan
30/Jan/2008
Garbsen, 30 January 2008 – LPKF Laser & Electronics AG has strengthened their presence in Laser Plastic Welding and MID in the US market by establishing a new sales office in Detroit, MI. Chris Korson, Business Development Manager, will oversee the office.
LPKF appoints new Managing Director for its Subsidiary LaserMicronics GmbH
21/Jan/2008
Garbsen/Germany, 21 January 2008 – The Board of Managing Directors of LPKF Laser & Electronics AG has appointed Lars Ederleh as new Managing Director of its subsidiary LaserMicronics GmbH with immediate effect. Ederleh has run the operative business of LaserMicronics since May 2005. The 34 year-old graduate engineer follows Kai Bentz, who was appointed to the Board of LPKF Laser & Electronics AG in October 2007.
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