Universal, compact, inexpensive: the new ProtoLaser U from the german laser specialist LPKF Laser & Electronics AG, breaks new ground in the UV laser machining of different materials – and boasts an outstanding entry price.
 
Universal, compact, inexpensive: the new ProtoLaser U from the german laser specialist LPKF Laser & Electronics AG, breaks new ground in the UV laser machining of different materials – and boasts an outstanding entry price.

Although it looks very similar on the outside to its twin, the LPKF Proto-Laser S, the hood hides a different laser source with special features of its own: with its UV laser system, the ProtoLaser U can cut, drill and structure almost any kind of material.

“Whilst the ProtoLaser S and its infrared laser is perfect for the structuring of printed circuit boards, the ProtoLaser U’s forte is micromachining,” explains LPKF Director Bernd Lange. And the attractive system price opens up UV laser technology to a bigger circle of users.

For instance, the LPKF ProtoLaser U can depanel individual PCBs from a large printed circuit board in a stress-free and precise process. It can also cut LTCC and prepregs, drill holes and microvias, structure TCO/ITO layers, and open up solder masks. The high pulse energy of the UV laser causes ablation without leaving behind any residues. The result: contours with very accurate geometries. The integrated vacuum table holds flexible and thin substrates safely and firmly in place.

The laser process is controlled by the integrated CircuitCAM software. Optimal parameters are already archived for numerous applications. The special operating mode enables the predefined production processes to be delegated to staff with only a superficial knowledge of laser processing – whilst experienced operators can make use of the whole spectrum of UV laser technology.

The LPKF ProtoLaser U is compact and laboratory-optimised. It is perfect for prototyping and the production of mini-series. The working area measures 229 x 305 millimetres, and it only needs one plug socket.

Short version

Universal, compact, inexpensive: the new ProtoLaser U from the german laser specialist LPKF Laser & Electronics AG, breaks new ground in the UV laser machining of different materials.

For instance, the LPKF ProtoLaser U can depanel individual PCBs from a large board in a stress-free and precise process. It can also cut LTCC and prepregs, drill holes and microvias, structure TCO/ITO layers, and open up solder masks. The high pulse energy of the UV laser causes ablation without leaving behind any residues. The result: contours with very accu-rate geometries. The integrated vacuum table holds flexible and thin sub-strates safely and firmly in place.

The LPKF ProtoLaser U is compact and laboratory-optimised. It is perfect for prototyping and the production of mini-series.



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