Garbsen, June 2008 – LPKF laser systems have significantly improved production reliability in the manufacture of modern electronic subassemblies. The non-touch laser process replaces mechanical methods when cutting flexible and rigid PCBs – sensitive components and solder connections are protected from possible damages. The focussed laser beam produces very fine cuts. PCBs – assembled or unassembled – experience no mechanical forces, and are not exposed to residual dust. This means that components can be placed closer to the cut – for more efficient use of the available space.
PCB manufacturers use the LPKF MicroLine series laser systems either as stand alone work stations or integrated within production lines.
LPKF Laser & Electronics AG produces machines and laser systems used in electronics manufacturing, the automotive industry and the production of solar cells. Approx. 75 per cent of its turnover is generated by exports. The company has approx. 360 staff around the world.

Flexible PCB, cut using an LPKF laser system, 300 dpi
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