Press > Press Releases > 2008
 
Deutsch  Русский  Français  Español  中文  Slovensko
International Site
Products Applications LPKF Group Investor Relations Press Support Contact

Cutting sensitive PCBs the gentle way

03/Jun/2008
Garbsen, June 2008 – LPKF laser systems have significantly improved production reliability in the manufacture of modern electronic subassemblies. The non-touch laser process replaces mechanical methods when cutting flexible and rigid PCBs – sensitive components and solder connections are protected from possible damages.
 
The focussed laser beam produces very fine cuts. PCBs – assembled or unassembled – experience no mechanical forces, and are not exposed to residual dust. This means that components can be placed closer to the cut – for more efficient use of the available space.

PCB manufacturers use the LPKF MicroLine series laser systems either as stand alone work stations or integrated within production lines.

LPKF Laser & Electronics AG produces machines and laser systems used in electronics manufacturing, the automotive industry and the production of solar cells. Approx. 75 per cent of its turnover is generated by exports. The company has approx. 360 staff around the world.

Cutting of Flexible Printed Circuits
Flexible PCB, cut using an LPKF laser system, 300 dpi

Word download (139 KB)
Image author
LPKF Laser & Electronics AG

Image utilization
Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Contact us to receive our press leaflet or picture material:

LPKF Laser & Electronics AG
Marketing/Press
Osteriede 7
D-30827 Garbsen
Germany

Tel.:  +49-(0)5131-7095-0
Fax:  +49-(0)5131-7095-90

Email: marketing@lpkf.de

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90