Garbsen, April 2008 – The new LPKF StencilLaser G 6060 is a fully enclosed laser cutting system for SMT stencils. The small footprint and light weight construction makes the system ideal for any environment. The system allows for high performance speeds up to 17,400 apertures per hour; three times faster than legacy stencil cutting systems. The StencilLaser G 6060 automatically adjusts to fit any stencil frame size up to 29” x 37.4” (740 x 950 mm) and has maximum cutting area of 24” x 24” (600 x 600 mm). A new loading routine shortens unproductive downtime time when switching between loose foils and framed stencils. The StencilLaser G 6060 offers easy operability integrating a touch screen with easy-to-learn multi-level user interface.
LPKF Laser & Electronics AG develops and distributes systems used in electronics production, the automotive industry, and in the manufacture of solar cells. Its export share is about 80 per cent. The Group has approx. 340 employees worldwide.

300 dpi
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