LPKF presents even faster StencilLaser
14/Nov/2007
Garbsen, November 2007 – The new StencilLaser G 6080 by LPKF Laser & Electronics AG presents a new milestone in the development of laser cutting systems for SMT stencils.
New solutions for the high volume production of 3D-MIDs using LPKF-LDS® method
14/Nov/2007
Garbsen, November 2007 – A new LPKF laser system increases the mass production throughput of three dimensional circuit carriers (3D-MIDs).
Laser Structuring of MEA films for Micro Fuel Cells
14/Nov/2007
Garbsen, November 2007 – LaserMicronics GmbH has developed a method for the structuring of MEA films (Membrane Electrode Assembly), which lie at the heart of micro fuel cells.
LPKF-LDS Process gains MID Industry Award in 2007
14/Nov/2007
Garbsen, November 2007 - First place in this year’s MID Industry Award goes to the T4T coupling housing for digital model railways; developed using the LPKF-LDS Process. Applications for the second and third place companies were also developed using the LPKF-LDS Process.
LPKF strengthens management
04/Oct/2007
Garbsen, 4th October 2007 – The Supervisory Board of LPKF Laser & Electronics AG appointed Kai Bentz to the Board of Managing Directors with immediate effect. The 35-year-old graduate economist joined LPKF AG in 2002, and was Group Finance and HR Manager before being promoted to the board.
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