Garbsen, November 2007 - First place in this year’s MID Industry Award goes to the T4T coupling housing for digital model railways; developed using the LPKF-LDS Process. Applications for the second and third place companies were also developed using the LPKF-LDS Process.
 
The coupling housing is part of a fully automated digital pairing system and is structured and metallized by LaserMicronics GmbH industry services.

The LPKF-LDS Process (Laser Direct Structuring) developed by LPKF Laser & Electronics AG integrates high resolution PCB layouts directly on 3D Molded Interconnect Devices (MID). It is used especially for series production in telecommunication and automotive electronics.


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