Garbsen, August 2006 – LPKF introduces the MiniContac RS, a desktop through-hole plating solution featuring Reverse-Pulse Plating. The MiniContac RS is the answer for cost-effective and space-sensitive throughhole plating of circuit boards in a prototyping or research environment.

Garbsen, May 2006 – The LPKF ProtoLaser 200 is a versatile state-of-the-art laser system, combining advanced laser technology, optics and table mechanisms, resulting in superior quality, speed and accuracy. This rapid PCB prototyping solution is perfect for the precision geometries demanded by RF, microwave, RFID, antennas, filters, etc. Laser structuring applies to nearly any substrate, such as FR4, flexible materials, ceramics, PTFE, and AL2O3 (alumina).

Garbsen, May 2006 – LPKF introduces the LPKF MultiCut at the SMT 2006 show in Nuremburg. The MultiCut, a laser cutting system designed especially for SMT stencil work, is a model of efficiency.

Garbsen, May 2006 – LPKF announces the newest version of the MicroLine 350D, a compact, versatile laser system designed especially for cutting and drilling flex circuits, cover foils, and ceramic substrates. The 350D meets the higher demands of development and production in the electronics industry, thanks to more than fifteen years of LPKF laser development experience.

Garbsen, May 2006 – LPKF Laser & Electronics has developed a process for laser structuring of three-dimensional circuit carriers; LPKF-LDS (laser direct structuring). This process is now used for production of Radio Frequency Identification (RFID) antennas as well as antennas for cell phones.