Garbsen, November 2006 – The new LPKF MicroLine UV 3000 laser cutting system represents the next generation from LPKF's successful MicroLine UV 350D, addressing critical applications in prototyping and pre-series production.
 
The MicroLine UV 3000 laser cutting system raises the bar with a new high speed linear drive, featuring greater positioning accuracy, higher speed and faster acceleration – resulting in slashed processing times.

LPKF MicroLine laser systems are fast, versatile tools, able to perform precision cutting, routing, skiving, drilling, cutting pockets, structuring of etch/solder resist, micromachining of ceramic substrates, and more. Time and money are saved because specific tooling is no longer required.