Garbsen, May 2006 – LPKF announces the newest version of the MicroLine 350D, a compact, versatile laser system designed especially for cutting and drilling flex circuits, cover foils, and ceramic substrates. The 350D meets the higher demands of development and production in the electronics industry, thanks to more than fifteen years of LPKF laser development experience.
 
The MicroLine 350D is precise and fast, efficiently cutting even the most sensitive material. The laser system, considerably faster than a mechanical system, is designed to reduce processing time and downtime, increasing overall productivity. The laser produces finer work than a mechanical system as well, combining extreme precision and the finest cutting capability to produce the most compact circuit layouts.

The MicroLine 350D includes a custom software suite designed to maximize all functions, from data preparation to full control of the machine. The software imports virtually every file type and offers complete control over the cutting of any shape.

The LPKF MicroLine 350D features an extremely precise positioning system, permitting a more efficient use of the work surface and setting new standards for the reduction of process times while cutting flex circuits, ceramics, and more.