Garbsen, August 2006 – LPKF introduces the MiniContac RS, a desktop through-hole plating solution featuring Reverse-Pulse Plating. The MiniContac RS is the answer for cost-effective and space-sensitive throughhole plating of circuit boards in a prototyping or research environment.
 
Single sided, double sided, and multilayer boards can quickly and easily be plated through by the MiniContac RS. The selectable Reverse-Pulse Plating creates a uniform distribution of conductor previously impossible in traditional unidirectional plating processes, allowing the MiniContac RS to plate holes as small as 0.2 mm (8 mils) smoothly – even with aspect ratios as challenging as 1:5 – in material as thin as 1.5 mm (60 mil). Thin or fragile materials can easily be placed in a support framework before processing.

The MiniContac RS features LPKF's standard approach to prototype plating solutions, favoring simple maintenance of chemical assets, and a semiautomated menu-driven control system.