Garbsen, April 2005 – The LPKF Laser Direct Structuring (LDS) process is used at Siemens Audiologische Technik GmbH to manufacture their Acuris P hearing aid by integrating three small microphones onto a compact Molded Interconnect Device (MID). The microphone modules are manufactured by LPKF laser systems at Harting Mitronics AG.

Garbsen, April 2005 – LPKF Laser & Electronics AG presents its MicroLine C-series laser system for cutting and depaneling assembled and unassembled printed circuit board panels at high speeds. The MicroLine C delivers contact-free operation, so it easily separates assembled circuit boards without subjecting the boards to production stress. It cuts any aperture shape and produces accurate contours around densely-populated component areas.

Garbsen, April 2004 – LPKF Laser & Electronics, the leading manufacturer of PCB prototyping equipment, announces the release of its new ProConduct™ via plating system. This compact system plates PCB through-holes without the need for chemical plating baths. It uses conductive polymer paste to quickly plate vias as small as 15 mils (0.4 mm) for double-sided and multilayer boards. The electrical resistance of ProConduct™ plating is extremely low with 19.2 mOhm depending on the material thickness.

Garbsen, April 2005 – The LPKF MicroCut stencil laser cuts any shape at up to 50,000 apertures per hour, making it suitable for high-end wafer stencil manufacturing. Its advanced cutting speed is accomplished by a specially-developed beam deflection system that operates more dynamically and precisely than typical x/y table systems.

Garbsen/Hannover, 22 March 2005 – LPKF Laser & Electronics AG, Garbsen/Hannover, the globally active specialist for system and process solutions for PCB technology and microelectronics, concludes the 4th quarter 2004 with much higher turnover and profit for the whole of 2004.