2005

Garbsen, April 2005 – The LPKF Laser Direct Structuring (LDS) process is used at Siemens Audiologische Technik GmbH to manufacture their Acuris P hearing aid by integrating three small microphones onto a compact Molded Interconnect Device (MID). The microphone modules are manufactured by LPKF laser systems at Harting Mitronics AG.read more...

Garbsen, April 2005 – LPKF Laser <entities0> Electronics AG presents its MicroLine C-series laser system for cutting and depaneling assembled and unassembled printed circuit board panels at high speeds. The MicroLine C delivers contact-free operation, so it easily separates assembled circuit boards without subjecting the boards to production stress. It cuts any aperture shape and produces accurate contours around densely-populated component areas.read more...

Garbsen, April 2004 – LPKF Laser <entities0> Electronics, the leading manufacturer of PCB prototyping equipment, announces the release of its new ProConduct<entities1> via plating system. This compact system plates PCB through-holes without the need for chemical plating baths. It uses conductive polymer paste to quickly plate vias as small as 15 mils (0.4 mm) for double-sided and multilayer boards. The electrical resistance of ProConduct<entities1> plating is extremely low with 19.2 mOhm depending on the material thickness. read more...

Garbsen, April 2005 – The LPKF MicroCut stencil laser cuts any shape at up to 50,000 apertures per hour, making it suitable for high-end wafer stencil manufacturing. Its advanced cutting speed is accomplished by a specially-developed beam deflection system that operates more dynamically and precisely than typical x/y table systems.read more...

Garbsen/Hannover, 22 March 2005 – LPKF Laser <entities0> Electronics AG, Garbsen/Hannover, the globally active specialist for system and process solutions for PCB technology and microelectronics, concludes the 4th quarter 2004 with much higher turnover and profit for the whole of 2004.read more...