Garbsen, April 2005 – The LPKF Laser Direct Structuring (LDS) process is used at Siemens Audiologische Technik GmbH to manufacture their Acuris P hearing aid by integrating three small microphones onto a compact Molded Interconnect Device (MID). The microphone modules are manufactured by LPKF laser systems at Harting Mitronics AG.
 
LPKF Laser & Electronics AG developed the LDS process for molded interconnected devices, which integrates high-resolution circuit layouts directly on three-dimensional components and carrier structures. This 3D-MID technology combines mechanical and electrical elements to produce extremely small electronic devices. The LDS process has demonstrated its ability to miniaturize three-dimensional electrical circuits in a large-scale production environment.

Additional applications for 3D-MID technology are mobile telecommunications, sensor development, the automobile and aviation industries, safety equipment engineering and the medical field.