Garbsen, April 2005 – The LPKF MicroCut stencil laser cuts any shape at up to 50,000 apertures per hour, making it suitable for high-end wafer stencil manufacturing. Its advanced cutting speed is accomplished by a specially-developed beam deflection system that operates more dynamically and precisely than typical x/y table systems.
 
With an effective material focus diameter of 20 µm, the LPKF MicroCut is exceptionally accurate and can produce sharp contours with radii of up to 10 µm. The stencil laser features proprietary LPKF PulseShape technology, which eliminates the heat effect that causes coining or warpage of high-density and thin stencils. The system also incorporates new cutting technology that avoids burrs at exiting edges, so no post-treatment is necessary.

Stencils produced with the LPKF MicroCut exhibit the high quality and manufacturing precision that is required for optimum release characteristics for stencil paste printing.