Garbsen, November 2005 – LPKF Laser & Electronics presents the new LPKF MicroLine 350Ci laser system for the stress-free depaneling of assembled PCBs.
 
The LPKF MicroLine 350Ci features higher cutting speeds for mechanical depaneling methods and requires no expensive tooling, making this machine very attractive for smaller batches as well.

The laser technique leaves no residual dust on the PCBs and causes no damage to sensitive components. The laser cuts any contours while maintaining a higher precision than mechanical routing systems. The non-contact and stress-free cutting process, with a very small beam diameter, allows components to be placed close to the edge of the board for optimum utilization of the panel.

The compact MicroLine 350Ci system can be integrated in an existing SMD production line, or used as a stand-alone work station.