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2004

Garbsen/Hannover – Ludwigshafen, 24 June 2004 - Laser manufacturer LPKF AG and the plastic producer BASF AG signed a know-how and licence agreement covering the LDS method for the production of 3D electronic circuits (3D-MID). This agreement makes new materials (PA, POM, PES and PSU) available worldwide for the LPKF LDS method. The high performance technical plastics made by BASF AG are already used for the production of electronic housings and components.read more...

Garbsen/Hanover, 19 May 2004 – the Q1 2004 report just published by LPKF Laser & Electronics AG, Garbsen/ Hanover, reveals a clear improvement in the company’s economic situation: whilst turnover has risen by around 11.4 per cent year-on-year to 5.09 million (4.56), earnings have increased by 61 per cent, and earnings before interest and tax (EBIT) has even grown by 72 per cent. However, one-off human resource costs and the weakness of the dollar mean that the company has posted a slight loss of K€ -84 (-217). Nevertheless,” says Chairman of the Board of Managing Directors Bernd Hackmann, “restoring dividend payments for 2003 is fully justified. Orders received in recent weeks from Asia in particular make us optimistic for the whole of 2004! The first quarter is usually the weakest in the year at LPKF.”
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Hannover, April 2004 - Electroforming can be used for the direct throughplating of PCBs in development labs. LPKF Laser & Electronics AG now presents at Interkama 2004 the new MiniContac S through-plating machine specifically designed for this purpose. This table-top device metallises PCB vias with a minimum diameter of 0.4 mm using the blackhole method.read more...

CPCA Shanghai, March, 2004 – LPKF Laser & Electronics AG, Garbsen, announces the founding of an applications center for PCB reworking in Shenzhen, PR China.read more...

Hanover, 23 March 2004 – LPKF Laser & Electronics AG, Garbsen/Hanover, will pay a dividend again for the 2003 financial year to give its shareholders a share of the company’s success. “This is a clear signal: we are optimistic about the company’s future,” said Bernd Hackmann to journalists in Hanover at the presentation of the annual accounts. Restoring the dividend should also demonstrate to shareholders that the cost-cutting and restructuring measures have been successful. In addition, Hackmann also said that the very promising 3D-MID licence and cooperation agreements with Degussa, Bayer, Ticona and Harting closed in 2003 underline the breakthrough of this technology developed by LPKF. The effects should be increasingly positive in the years to come. Turnover is forecast to rise by a double-figure percentage in 2004 accompanied by an improved EBIT.read more...

 
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LPKF Laser & Electronics AG
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D-30827 Garbsen
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