2003

Garbsen, November 2003 – LPKF Laser & Electronics AG demonstrated at Productronica 2003 their wafer stencil cutting speed of up to 50,000 cutouts per hour. The very small cutouts can be made in any shape, and with a minimum radius of only 10 micrometers.read more...

Garbsen/Hanover, 20 November 2003 – The sales of MicroLine Lasers in North America and Germany played a major part in the profit of LPKF Laser & Electronics AG, Garbsen/Hanover after the first nine months of this year. As shown in more detail in the Q3 report now published, the cost-cutting measures initiated at the start of 2003 are now starting to bite. According to Management Board Chairman Bernd Hackmann they: “made a contribution to the satisfactory results in the first three quarters of the financial year.” Although consolidated turnover in the reporting period at € 16.20 million (18.27) is still around 11.3% down year-on-year, this is a clear “improvement” on the turnover after six months which was down around one quarter on the same period the previous year. The consolidated profit of € 0.73 million (0.82) is also a positive sign and now only down 11.2% year-on-year. “Especially the third quarter shows LPKF’s potential of generating excellent returns on sales against the background of increasing turnover and stable fixed costs,” says Hackmann.read more...

Garbsen, 12.11.2003 – LPKF Laser & Electronics AG and the Harting technology group have signed a cooperation agreement. This partnership enables Harting to produce and further develop 3D-MIDs for micro-packaging in particular – using the LPKF LDS method. Micro-packaging is used for very compact housings for chips and
similar components and is therefore a very small type of MID (moulded interconnectdevice).read more...

Garbsen/Kelsterbach, October, 2003 - LPKF Laser & Electronics AG and Ticona GmbH closed a know-how and license agreement in October, 2003 for applying laserstructurable Vectra® LCP E 820i LDS highperformance plastic to Laser Direct Structuring (LDS) additives to produce 3D injection-molded circuit carriers. The  agreement gives Ticona access to LPKF granulate production technology for manufacturing 3DMID circuit carriers.read more...

Garbsen/Hanover, 21 August 2003 – Although the continuing weakness of the global electronics market has cast a shadow over the results of LPKF Laser & Electronics AG, Garbsen/Hanover, in the first half of the financial year, the executive board chairman Bernd Hackmann sticks to the statement he made at the annual general
meeting: “Even after the decline in turnover of more than 25 per cent in the first half compared to the previous year, we are not wavering from our forecast that we can achieve the same turnover in the whole of 2003 as was generated in the preceding financial year!”read more...