Florian Roick will be taking on a larger role as Strategic Product Manager at LPKF. From January 1, 2017, he will be responsible for the laser systems and processes for Laser Direct Structuring (LDS). These systems are used for producing high-precision, fine 3D traces on plastic parts in MID projects and IC packaging.read more...
The role of laser technology in the manufacture of electronic components and products continues to grow. For instance, more than 20 different laser processes are used in the production of smartphones, such as for structuring thin layers, for producing three-dimensional conductor structures on plastic bodies, and for cutting glass and printed circuit boards.read more...
Ultrashort-pulse prototyping laser for challenging high-frequency applications
For RF applications, the shorter the wavelength, the greater the effect of geometric deviations on the board. The LPKF ProtoLaser R uses an ultrashort-pulse laser for particularly precise and gentle processing.read more...
LPKF paper at the Laser Manufacturing Conference available as a TechPaper
Thanks to the reliability of the welding results, laser plastic welding has become established as the technical standard for mass production. Now with a new technology, LPKF is targeting the challenging medical applications sector, and is focusing on researchers and developers with demanding specifications for the joining technology.read more...
LPKF equips German Armed Forces with circuit board plotters
More than 50 challenging civilian occupations await young people at the Bundeswehr, and electronics plays an important role in some of them.read more...
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