Hanover, April 2002 - They are easy to handle, highly functional and the ideal solution for boards with high packing densities: Ball Grid Arrays (BGAs) are more and more becoming the key component for the miniaturization of electronic subassemblies. Because the connecting pads are no longer visible due to their position, BGAs constitute a real assembly challenge. With its assembly tool ZelPlace BGA, LPKF has now provided a method to place these new components on the board in a precise and reliable way. read more...
Munich, November 2002 - Erlangen-based Laserquipment AG founded in December 2002, develops and markets innovative system concepts for laser plastic welding, and also provides the associated services.read more...
Nuremberg, June 2002 - LPKF is well known as a system supplier for the rapid and flexible production of circuit board prototypes using all standard technologies. Now, with the LPKF ProtoMat C40, LPKF has developed a circuit board plotter which combines the benefits of a multipurpose entry model with the addition of sophisticated features.read more...
Hanover, April 2002 − The MicroLine Drill 600 by LPKF is a tool which allows small and medium-sized PCB manufacturers to meet the growing demand for high density interconnect (HDI) PCBs with microvias and ultra-fine printed conductors.read more...
May 2003 - PA6/6TMID, a new high temperature plastic from LPKF, enables the processing of laser direct structured injection moulded circuit carriers in a reflow soldering process for the first time.read more...
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