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2003

Garbsen, November 2003 – LPKF Laser & Electronics has developed the MicroLine 3D IR Industrial laser system for the production of three-dimensional injection-molded interconnect devices (3D-MIDs). read more...

Garbsen, November, 2003 – LPKF Laser and Electronics AG introduces the MicroLine Cut 350, a compact, low-cost laser system that joins LPKF’s MicroLine Drill product family. This versatile laser system offers a large range of functions and is suitable for cutting flexible and rigid PCBs, structuring ultra-fine tracks on copper and resist, and creating openings in solder resist and cover foils, as well as drilling and cutting ceramics, plastics, and green tapes.read more...

Garbsen, November 2003 - As the high-end model of the LPKF circuit board plotter family, the ProtoMat H100 sets new standards for PCB prototyping and small series production. With a positioning speed of 100 mm/s, which is twice as fast as previous top-of-theline systems, and a milling motor speed of 100,000 rpm, the ProtoMat H100 sets new quality and speed metrics for in-house production. The plotter can create 3 mil tracks with 4 mil spacing, which accommodates all state-of-the-art packages,  including BGA and ìBGA®.read more...

Garbsen, November 2003 - LPKF Laser & Electronics AG introduces the ScanCheck MicroView – a fast, high resolution inspection system for wafer stencils with 24,000 dpi resolution.read more...

Garbsen, November 2003 – LPKF Laser & Electronics AG demonstrated at Productronica 2003 their wafer stencil cutting speed of up to 50,000 cutouts per hour. The very small cutouts can be made in any shape, and with a minimum radius of only 10 micrometers.read more...

 
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