Garbsen, November 2004 - LPKF Laser & Electronics AG presents the LaserScalpel, the first laser-based PCB reworking tool that removes copper bridges on printed circuit boards with very fine structures.read more...
Garbsen, November 2004 – The LPKF MicroCut can cut any shape at speeds up to 50,000 apertures per hour. With this capability, the MicroCut delivers double the cutting speed of current state-of-the-art stencil cutting lasers.read more...
Garbsen, November 2004 - LPKF Laser & Electronics AG announces the new ProtoLaser 100, an easy-to-operate high-performance laser structuring system for printed circuit board prototyping.
Hanover , September 2004 - LPKF Laser & Electronics AG presents the new LPKF MicroLine 740C laser system, the perfect tool for high-speed contour cutting of rigid and flexible PCBs. High throughput performance is ensured by a new CO2-Laser which precisely machines boards up to 31’’ x 28’’ without dust.read more...
Garbsen/Hannover – Ludwigshafen, 24 June 2004 - Laser manufacturer LPKF AG and the plastic producer BASF AG signed a know-how and licence agreement covering the LDS method for the production of 3D electronic circuits (3D-MID). This agreement makes new materials (PA, POM, PES and PSU) available worldwide for the LPKF LDS method. The high performance technical plastics made by BASF AG are already used for the production of electronic housings and components.read more...
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