From the idea to the 3D circuit carrier in one day
3D MID (three-dimensional molded interconnect device) technology has progressed in leaps and bounds over the last few years, and the LDS (laser direct structuring) process has led the way. More than half of all smartphones are now equipped with LDS antennas. LDS has also been gaining a foothold in the automotive industry, medical technology, and consumer products.read more...
Automated machining of circuit boards with a UV laser
The MicroLine UV laser systems are setting standards in non-contact machining of circuit board materials. They can cut, drill, and depanel delicate boards, for example, for smartphone production.read more...
LPKF presents spot welding process for stencils
A step stencil is an SMD stencil made with local depressions (step-down) or raised areas (step-up) to allow the solder paste volume to be varied locally. This allows for mounting of both SMD components with a low pitch and robust connection components on PCBs in a single step. read more...
LPKF Laser & Electronics AG presents a spectacular new development: The LPKF ProtoMat D104 unites the best features of advanced LPKF ProtoMats with the high precision of the ProtoLaser systems. The highlight of this product innovation is a special UV laser.read more...
LPKF presents new systems in Hall B2, Booth 105
The productronica is an important trade fair for LPKF Laser & Electronics AG. In time for the opening the specialist in micro-material processing presents new systems and procedures.read more...
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