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Latest Press Releases

15.11.2017

Technology for micro processing of glass awarded

With the LPKF Induced Deep Etching (LIDE) laser from LPKF, the expert jury of Productronica honors a process that unlocks the full potential of glass for microsystems technology. The LIDE process is a combination of laser modification and wet chemical etching.

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15.11.2017

Ultrashort pulse laser processing for research

LPKF recently launched its newly developed ProtoLaser R onto the market, particularly for use in research and development laboratories. It enables high-end processing of thin layers and particularly sensitive materials.

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15.11.2017

Laser cutting of printed circuit boards with even more Power

Increased laser power of about 80% makes this possible: The effective cutting speed of the LPKF MicroLine systems can be significantly increased with the new UV laser - even doubled, depending on the layout and material used.

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29.06.2017

Glass Processing with the LPKF ProtoLaser R

As the new YouTube film from LPKF demonstrates, “glass is no longer transparent,” but can be processed “cold” using special laser technology. Glass and other heat-sensitive materials with properties especially compatible with electrical circuits can now be cut, ablated, or structured in a damage-free process.

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29.06.2017

RF Material Processing with the LPKF ProtoLaser U4

The new LPKF ProtoLaser U4 with a UV laser source is an innovative multitalent recommended for numerous material groups thanks to its UV wavelength of 355 nm: for machining RF filters or patterning LTCCs or completely new material groups for electronics laboratories.

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