The LPKF share is listed in the TecDAX technology index.
2010 – Breakthrough for industrial UV laser cutting with the ML 1000S
The compact UV laser system combines a high cutting speed with utmost precision at LPKF quality levels.
2010 – Hermes Award
LPKF received the renowned Hermes Award for the Fusion3D laser structurer.
2009 – Breakthrough in LDS mass production
The Fusion3D makes a breakthrough in the mass production of three dimensional interconnect devices (laser direct structuring, LDS).
2008 – A revolution for RF and digital boards
ProtoLaser S the only prototyping laser system worldwide able to structure laminated substrates.
2007 - LPKF starts with solar technology
The newly established subsidiary LPKF SolarQuipment GmbH develops and produces laser systems for the structuring of thin film solar cells.
2006 - LPKF-LDS process used in series production
The LPKF-LDS process is used in the series production of three-dimensional molded interconnect device (MIDs).
2001 - Laser system for the circuit board industry
LPKF develops and produces the laser system MicroLine for drilling and structuring of printed circuit boards.
2000 - First location in China established
LPKF starts with laser plastic welding technology LPKF Tianjin CO. Ltd. is established as a new subsidiary in China. LPKF joins the Laserquipment AG, which produces and distributes systems for the laser plastic welding.
1998 - LPKF is listed at the Stock Exchange
In this year the newly created LPKF Lasers & Electronics AG is registered at the New Market.
1994 - Establishment of the new production site in Slovenia
LPKF establishes LPKF Laser & Electronika d.o.o. as a new production location in Slovenia.
1991 - Establishment of LPKF Motion & Control GmbH
The development of the laser systems advanced the development of innovative drive and control techniques. Thus together with the technical University Ilmenau, LPKF Motion & Control GmbH is created.
1993 - Presentation of the first StencilLaser
LPKF presents the first StencilLaser for the production of SMD stencils.
1989 - LPKF starts with laser technology
In 1989 LPKF develops a procedure for the laser based printed circuit board structuring.
1984 - Structure of an international sales network
With the establishment of the branch in the USA the foundation stone for a worldwide sales network is put in place.
1976 - Establishment
Establishment of the LPKF CAD/CAM Systeme GmbH in Hanover. Introduction and production of the first prototyping system: the LPKF 39.
1975 - The Patent
In the mid 1970's the patent engineer Juergen Seebach developes a mechanical procedure for the production of printed circuit boards and a milling depth limiter. From this development comes the registration of a worldwide patent in 1976.