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Milling and Drilling of Printed Circuit Boards

Rapid PCB Prototyping

Laser Cut Stencils

Production of
Laser Cut Stencils

SMT Stencil Technology


Profitable Laser Cutting of PCBs / FPCs

Profitable Laser Cutting
of PCBs / FPCs

PCB Processing Technology

Stress-free Laser Depaneling of Assembled PCBs / FPCs

Stress-free Laser Depaneling
of Assembled PCBs / FPCs

PCB Depaneling Technology

LDS Circuitry

Solutions for Manufacturing
3-Dimensional Circuitry

MID Technology

Laser Plastics Welding

Systems and Services for
Laser Plastic Welding

Laser Plastic Welding

Thin Film Solar Module Production

Structuring of
Thin Film Solar Modules

Solar Cell Technology

News Investors

Latest Ad-hoc Message

LPKF signs Major Frame Contract for Solar Module Equipment
December 22nd 2011

Current Declaration

Declaration of Compliance 2011

Current Company Presentation

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Current Financial Report

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New Products

Laser structuring of 3D circuit carriers

The LPKF Fusion3D 1000 is ideal for the production of small and medium sized batches, as well as for industrial prototyping.

The entry model for Laser Direct Structuring


Prototyping with the ProtoMat S103

The high rotational speed and precision enable producing state-of-the-art PCBs. The Pneumatic non-contact working depth limiter allows processing even sensitive substrate surfaces.

High-end system for RF and microwave applications

                                       
LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90
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