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Welcome to LPKF
ProtoMat S Series

Milling and Drilling of
Printed Circuit Boards

Rapid PCB Prototyping

Laser Cut Stencils

Production of
Laser Cut Stencils

SMT Stencil Technology


Profitable Laser Cutting of PCBs / FPCs

PCB / FPC
Laser Cutting Systems

PCB Processing Technology

Stress-free Laser Depaneling of Assembled PCBs / FPCs

Laser Depaneling of
Assembled PCBs / FPCs

PCB Depaneling Technology

LDS Circuitry

Solutions for Manufacturing
3D Circuitry

MID Technology

Laser Plastics Welding

Systems and Services for
Laser Plastic Welding

Laser Plastic Welding

Thin Film Solar Module Production

Structuring of
Thin Film Solar Modules

Solar Cell Technology

News

Press releases

LPKF makes a strong start to 2013
May 15th, 2013

LPKF Develops Powder Coating for LDS Applications
May 7th, 2013

Read more press releases

Trade shows & events

MD&M East
Philadelphia PA, USA
June 18th - 20th, 2013

More trade shows & events
Investors

Presentation Conference Call First Quarter 2013

PDF download

Annual General Meeting 2013

Information and downloads

Quarterly financial report 1st quarter 2013

PDF download

Annual report 2012

PDF download

Declaration of Compliance 2013

PDF download

Quicklinks

Current Share Price
Financial Calendar
Subscribe to Financial News
Downloads
New Products

The laser processing of PCBs

The laser depaneling system MicroLine 6000 P ensures highly precise processing results during industrial laser processing. It cuts with no mechanical or thermal stresses on the component.
PCB laser cutting machine

Micro-material processing with laser systems

ProtoLaser U3The ProtoLaser U3 is ideal for the creation of high quality prototypes, the production of small batches, and the manufacture of individual components with a large degree of customization.
UV laser for development work

                                       
LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
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