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LPKF Laser & Electronics AG
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Welcome to LPKF Laser & Electronics AG


Rapid PCB Prototyping
Fast and effective in-house production of prototype printed circuit boards.

SMT Stencil Technology
Laser technology for manufacturing of SMT stencils with highest speed and precision.

PCB Cutting Technology
Professional laser processing of printed circuit boards, as well as cutting of flex circuits and cover foils.

MID
Laser structuring of moulded interconnected devices (MIDs) with the LPKF-LDS process.

Laser Plastics Welding
Systems and services for laser welding of plastics.

Depaneling of Assembled PCBs:

Stress-Free Depaneling of Assembled Printed Circuit Boards (PCBs)The new LPKF MicroLine 6000 S is ideal for clean and particulate-free separation of single boards from a larger panel of flexible, thin rigid and rigid-flexible PCB materials.
about depaneling of assembled PCBs

Laser micromaterial processing of a broad spectrum of materials

LPKF ProtoLaser UThe LPKF ProtoLaser U processes almost all types of material like ceramics, LTCC, FR4, protective films and metal foils, or flex and rigid-flex materials.
about laser micromaterial processing

LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90
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