Welcome to LPKF Laser & Electronics AG
Rapid PCB PrototypingFast and effective in-house production of prototype printed circuit boards.
SMT Stencil TechnologyLaser technology for manufacturing of SMT stencils with highest speed and precision.
PCB Cutting TechnologyProfessional laser processing of printed circuit boards, as well as cutting of flex circuits and cover foils.
MIDLaser structuring of moulded interconnected devices (MIDs) with the LPKF-LDS process.
Laser Plastics WeldingSystems and services for laser welding of plastics.
Depaneling of Assembled PCBs:

The new LPKF MicroLine 6000 S is ideal for clean and particulate-free separation of single boards from a larger panel of flexible, thin rigid and rigid-flexible PCB materials.
about depaneling of assembled PCBsLaser micromaterial processing of a broad spectrum of materials

The LPKF ProtoLaser U processes almost all types of material like ceramics, LTCC, FR4, protective films and metal foils, or flex and rigid-flex materials.
about laser micromaterial processing