News

Professional Rapid PCB Prototyping /
LPKF at embedded world 2010
January, 21st 2009

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Trade Shows

Embedded, Germany
March, 02nd - 04th 2010

Apex, USA
April, 06th - 08th 2010

Hanover Fair, Germany
April, 19th - 23rd 2010

More trade shows

Investor Relations

Interim Report Q3/09 (627 KB)

09.11.2009 / LPKF raises forecast for 2009 (9 KB)

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Welcome to LPKF Laser & Electronics AG

Rapid PCB Prototyping
Fast and effective in-house production of prototype printed circuit boards.

SMT Stencil Technology
Laser technology for manufacturing of SMT stencils with highest speed and precision.

PCB Processing Technology
Laser processing of printed circuit boards, as well as cutting of flex circuits and cover foils.

PCB Depaneling Technology
Laser depaneling of printed circuit boards (PCBs) for highest requirements.

MID
Laser structuring of moulded interconnected devices (MIDs) with the LPKF-LDS process.

Laser Plastics Welding
Systems and services for laser welding of plastics.

High Volume Production of MIDs:

Fully equipped laser system LPKF Fusion3D designed for 24/7 production of molded interconnect devices (MID).
about MID laser structuring

PCB Depaneling and Cover Layer Cutting:

Economical laser system LPKF MicroLine 1000 E for depaneling assembled, unassembled printed circuit boards (PCBs) and for cover layer cutting.
about laser depaneling and cutting

LPKF Laser & Electronics AG Osteriede 7 D-30827 Garbsen Germany Tel.: +49-(0)5131-7095-0 Fax: +49-(0)5131-7095-90