Through-Hole Plating

Quality prototype boards must ensure proper electrical connectivity between the top, bottom, and inner layers. Through-hole plating typically reduces the board’s layout density and the number of vias. LPKF provides several effective through-hole plating solutions, based on board complexity.

Galvanic Through-Hole Plating

Specially developed to produce the highest professional-quality through-hole plating results for double-sided and multilayer boards. These galvanic systems apply reverse pulse plating technology, which provides uniform copper plating as well as plating of difficult aspect ratios and very small holes.

Reverse pulse plating avoids the “bone effect” (thicker copper growth at the hole entrance) that can clog up small via holes entirely before they are completely plated. It is very useful for achieving quality plating results with small holes on high-density PCBs, and for improving production reliability during soldering.

Chemical-Free Through-Hole Plating

With its chemical-free through-hole plating process the LPKF ProConduct® is adapted for the through-hole plating of double sided and multilayer boards.

All vias are coated with the specially developed paste by using a squeegee and a vacuum table. After curing the paste in the hot air oven the circuit board can be populated with components and be tested.

Mechanical Through-Hole Plating

A simple, easy, and low-cost method for manually applying mechanical though-hole plating to small boards with 50 or fewer plated holes.