Solder Paste Stencils and Assembly Control Foils

Milled foils for applying solder paste (SMT stencils) and assembly control

Milling polymer stencils with LPKF circuit board plotters is a genuine alternative to steel stencils in the rapid PCB prototyping process, especially regarding cost effectiveness. The solder paste stencils can be milled inhouse in less than 10 minutes on average. The production of the milling data over inverse isolation from LPKF CircuitCAM is extremely simple. The pads are encircled for isolation then milled out.

With the milling of polymer stencils, the advantages of speed and security can be improved upon when applying solder pastes. In combination with the SMT solder paste printer, ZelPrint LT300, and an LPKF circuit board plotter, screen printing is an economical solution for the rapid PCB prototyping, especially when compared to the work required when using a dispenser or soldering by hand.

Polymer foils for assembly control or for solder paste stencils can easily be manufactured with LPKF ProtoMat systems. This eliminates the need for a photoplotter or the cost of having the process performed by a subcontractor.

The process of milling precisely-defined openings in special foils makes other applications possible. For example, openings in the form of solder-stop foil stencils for monitoring correct circuit board assembly, or openings in the form of an SMD prototype stencil for the application of solder paste.