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Layer Lamination Solutions

A deterrent to producing multilayer printed circuit boards in-house is the inability to do layer lamination into a single PCB. Consequently, designers must rely on an outside vendor for their multilayer board production, which can delay product development and increase costs if the vendor’s board turnaround times are slow.

The LPKF MultiPress S solves this problem with the ability to laminate multilayer PCBs in-house of up to six layers, drastically reducing prototype turnaround time and cost. The MultiPress S is a compact tabletop unit that can handle board sizes up to 10" x 12", and it works with all common multilayer materials.
Product information
Brochure  (159 KB)
WMV (580 KB)

Further links
Circuit Board Plotter
Multilayer
Through-Hole Plating
SMD Assembly


More information
Product Catalog  (5408 KB)

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LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90