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Milled Polymer Foils

Milled Polymer Foils
 
Polymer foils for assembly control or for solder paste stencils can easily be manufactured with LPKF ProtoMat systems. This eliminates the need for a photoplotter or the cost of having the process performed by a subcontractor.

The process of milling precisely-defined openings in special foils makes other applications possible. For example, openings in the form of solder-stop foil stencils for monitoring correct circuit board assembly, or openings in the form of an SMD prototype stencil for the application of solder paste.
Further links
Circuit Board Plotter
Multilayer
Through-Hole Plating
SMT Assembly


More information
Product Catalog  (5408 KB)

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LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90