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Cutting and Drilling Ceramics

Keramikschnitt
 
LPKF systems can cut, drill, and skive green or fired ceramic materials like Alumina, silicon nitride, and polycrystalline silica. This is useful for cutting the outline or inner contours of ceramic boards. The LPKF ProtoLaser is an ideal tool for working with ceramic substrates.


Further links
Circuit Board Plotter
Multilayer
Through-Hole Plating
SMD Assembly


More information
Product Catalog  (5510 KB)

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